IG-200 – Grounding and Bonding Methods (5 labs) (3 days)

IG-200 Course

iGround – What Sets Our Training Apart (PDF)

Don’t just get opinions or poor interpretation on the difficult subjects of bonding and grounding….get the FACTS and apply what you’ve learned! The five hands-on labs highlight the application of the test equipment, data collection/analysis, and report generation to communicate the deficiencies often encountered in the field. These issues may be related to a variety of components that impact lightning system evaluation, grounding, bonding, electrical safety, and electronic equipment performance.
This course will present and utilize multiple sources of information used for many power and grounding applications including the National Electrical Code©, IEEE® Green and Emerald Books, IBEW® training guidelines, NFPA® publications, and many others.

This course will present and utilize multiple sources of information used for many power and grounding applications including the National Electrical Code©, IEEE® Green and Emerald Books, IBEW® training guidelines, NFPA® publications, and many others.

 

Course Outline

Chapter One – Why Bonding/Grounding?

  • What is Grounding/Bonding?
  • NEC© definitions
  • Overview of different systems
  • Lightning and Lightning Protection
  • Personnel Safety
  • Documentation
  • Personnel Involved
  • Where do we go from here?

Chapter Two – Electrical and Metering Principles

  • Volts, Ohms, Amperes
  • Lenz’s Law
  • Resistance and Diffraction
  • Circular Mils/Area of Conductor
  • Insulation Materials/ Temperature Coefficient
  • Impedance
  • Conductor Properties Impacting Impedance
  • Inductive Reactance/ Capacitive Reactance
  • Impedance of Conductors
  • Waveform Propagation
  • Three-Phase Systems
  • Single-Phase Systems
  • Premises Wiring System Components
  • Separately Derived Power System

Chapter Three – Grounding Electrode System

  • Grounding Electrode System Purpose
  • Grounding Electrode System Components
  • The Earth as a conductor
  • Basics of Earth Ground Resistance Measurements
  • Other Approved Methods
  • Improving Earth Ground Resistance
  • Types and Selection Criteria of Grounding Electrodes
  • Grounding Electrode Conductor and Installation Req’s
  • Grounding Electrode Conductor Terminations

Chapter Four – Grounding Electrode System

  • Equipment Grounding System Purposes
  • Types of Equipment Grounding Conductors (EGC’s)
  • Sizing of EGC
  • Types of Electrical System Faults
  • Conductor Routing
  • Fault Circuit Demonstration
  • Improper Neutral – Ground Bonding
  • Wiring Lab

Chapter Five – Troubleshooting

  • IEEE® Categories of Problems
  • Troubleshooting Methodology
  • Types of Equipment to Use
  • Average Responding vs. True RMS
  • Wiring and Grounding Lab
  • Review Results

Chapter Six – Telecommunication System Bonding

  • Purposes of the Telecommunications Bonding System
  • Telecommunication Bonding Systems Components
  • Small/Large System Arrangements (TIA-607 & BICSI)
  • Sizing of Bonding Conductors
  • Conductor Sizing Practice Exercises
  • Raised Floor Bonding
  • Equipment Rack/Cable Tray Bonding
  • Bonding Between Buildings
  • Data Center Bonding
  • R56 Bonding Application
  • Radio/Antenna site Grounding/Bonding
  • Sample Sites
  • Surge Protector Grounding/Bonding
  • Site Examples
  • Two-Point Bonding Test Lab